Suppliers to the Semi and Microelectronics Industries since 1989
GT / GTL Silver Button Sockets
BGA sockets using GT contact technology provide >75GHz signal speed in a smallest footprint for prototype and test applications. These sockets support pitches from 0.3mm to 1.27mm. Standard sizes typically ship within 5 days ARO.
Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 75GHz) and supports BGA packages with pitches down to 0.3mm was utilised in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
They support IC devices with body sizes ranging from 50mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminium heat sink screw to provide compressive force. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with a custom heat sink. The user simply places the IC into the socket, places the compression plate, swivels the lid, and applies torque to heat sink screw to connect the IC. If there are pre-existing holes in the PCB, a GT elastomer BGA socket can be custom designed to accommodate those holes (please call Ironwood Tech Support @1-800-404-0204). Typical GT elastomer BGA socket with swivel lid is shown in the figure.
GT is a new elastomer technology that has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and extreme temperature ranges. GT is available for BGA, PoP and other packages from 0.3mm to 1.27mm pitch. The contact resistance is <30 milli-ohms. The operating temperature range for the elastomer is -55C to +160C.
SG/CG - GHz Elastomer Sockets
GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF (Zero Insertion Force) socket for prototype and test applications. Our sockets support pitches down to 0.3mm.
Ironwood's GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with a custom heat sink. The user simply places the IC into the socket, places the compression plate, swivels the lid, and applies torque to heat sink screw to connect the IC. It is compatible with the alternate SBT-BGA (spring pin) socket footprint and other socket technologies as well. If there are pre-existing holes in the PCB, a GHz elastomer socket can be custom designed to accommodate those holes (please call Ironwood Tech Support @1-800-404-0204). Typical GHz elastomer socket with swivel lid is shown in the figure.
The Z-axis conductive elastomer used in the socket, as a contactor between the IC package and the circuit board, is a low resistance (<0.05ohms) connector. The elastomer consists of a fine pitch matrix of gold plated wires in a soft insulating sheet of silicone rubber. The gold-plated brass filaments protrude several microns from the top and bottom surfaces of the silicone sheet. The self inductance is 0.06 nH. Current capacity is 2A per contact. The operating temperature range for the elastomer is -35C to 125C.
SM/SMP - Silver Ball Matrix Sockets
Ironwood Electronics SM/SMP socket uses SM & SMP contact technology for high speed, low inductance, high endurance and wide temperature applications. SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages.
The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
Ironwood Electronics SM sockets are small footprint sockets and compatible with other Ironwood socket line for switching contacts to test different applications. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. Various lid options are available such as swivel lid, clamshell lid with a wave spring, double latch lid to provide the compression force. If heat dissipation is of concern, a heat sink can be integrated in the middle of any type of lid to dissipate up to 100 watts.
Typical specifications for the SM/SMP contact technology include:
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Over 40GHz bandwidth @-1dB for edge pins
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Contact resistance under 15mOhms
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Self inductance under 0.21nH
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Capacitance under 0.15pF
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Operating temperature range -55C to +150C
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Insertion/Extraction life over 500, 000 cycles with protective plunger matrix
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Current rating at 14C temperature rise is 4 Amps per pin
SBT/CBT - Stamped Spring Pin Sockets
SBT sockets simplify lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin sockets. To use, drop the IC into the socket, place the floating compression plate over the IC, add the swivel lid (with key-hole slots), and apply a normal force to the IC using the compression screw. Alternately, these sockets come with easy open/close clamshell lids for quick chip replacement. SBT sockets can be used for hand test or quick turn custom burn-in applications with the most stringent requirements.
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilising only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customised to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
Typical specs for SBT technology sockets:
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4GHz - 31.7GHz bandwidth @-1dB
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Contact resistance under 15mOhm
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Self inductance 0.88 - 0.95nH
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Capacitance under 0.3pF
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Operating temperature range -55C to +180C
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Insertion/Extraction life over 500,000 cycles
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Current rating at 80C temperature rise is 4A - 8A per pin
XG - Silver Particle Interconnect Sockets
Xtreme silver particle GHz interconnect (XG) technology allows sockets to operate at very high frequency and high current applications for BGA and QFN. XG socket is particularly effective for pitch conversion and impedance matching with very low series resistance but requires tight co-planarity.
XG socket technology is designed for wide variety of IC package sizes to operate at bandwidths up to 40 GHz with less than 1dB of insertion loss, temperature range to 100C, and high number of insertions. The tables below show the sockets that are available immediately. In addition custom sockets using these technologies can be in your hands in a matter of weeks. XG sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint) and are compatible with the alternate socket technologies footprint as well.
The sockets have a precision design, which guides the IC ball to the exact position for connection to corresponding PCB pad and uses an aluminum heat sink screw to provide compressive force. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with a custom heat sink. The user simply places the IC into the socket, places the compression plate, swivels the lid, and applies torque to heat sink screw to connect the IC.
Silver particle contactor is a low resistance (<0.05ohms) connector held in flex substrate. The top side of contactor consists of gold/nickel plated individual copper pads with spiked caps that make contact with package leads/balls. The bottom side of contactor consists of silver filled individual silicone rubber pads that compresses against PCB pads. At compressed state, the distance between DUT pad and PCB pad is very similar to solder height which makes the XG interconnect transparent to electrical signal. XG interconnect delivers the clearest possible signal due to the extremely short current path, low resistance, and ultra-low inductance and capacitance. Kapton substrate holding individual interconnects provide over-compression stop preventing damage to elastomer pads.
Typical specifications for the XG interconnect include:
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40 GHz Bandwidth
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0.11 nH Self Inductance
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0.015 nH Mutual Inductance
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0.028 pF Mutual Capacitance
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Less than 50 mOhms Contact Resistance
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-40C to 100C
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5 Amps per pin
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25-50 grams per pin
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10,000 Insertions
SS - Spring Pin Sockets
Sockets for High Temperature & High Endurance Applications
The Spring Pin Socket line allows very high endurance and wide temperature range testing of 0.3mm to 1.27mm pitch BGA, LGA , QFN QFP and SOIC devices on the same footprint as other Ironwood socket technologies. This allows different PCB's with same footprint to accomplish many different test applications.
Spring pin sockets provide high bandwidth in a small, cost effective design. Spring pin socket is a simple, mechanical socket based on Pogo (spring) pin technology. Spring pin socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The PCB should have mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). The typical Spring pin socket footprint is only 5mm larger than the maximum IC size which means series resistors, capacitors, tuning inductors and others can be placed minimal distance from IC in GHz applications. The socket is mounted to the PCB with a backing plate and for all IC body sizes, spring pin sockets require a rigid metal backing plate to prevent deflection of the target circuit board due to a high normal force required to compress the spring pins. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB. The socket is constructed of aluminum to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The user simply places the IC into the socket, closes the lid, and rotates the heat sink screw to connect the IC. It is compatible with the alternate SG-BGA (elastomer) socket footprint and other socket technologies as well. If there are pre-existing holes in the PCB, a Spring pin socket can be custom designed to accommodate those holes (please call Ironwood Tech Support @1-800-404-0204). Typical spring pin socket with clam shell lid is shown in the figure.
The spring pin functions as the contactor between the IC package and the circuit board. The spring pin used in the socket is a low-resistance (<0.02ohms) connector. 1mm center - double ended spring pin is shown in the picture. Double ended spring probes are primarily comprised of two plungers, barrel and spring. The spring (gold plated music wire) is sandwiched between two plungers (gold plated hardened Beryllium Copper) inside the barrel (gold plated Phosphor Bronze). The spring probe has high current rating (4.0A continuous, single probe in free air @ ambient). The operating temperature range is -40C to 150C. The self inductance of the contactor is typically 0.62nH per pin. The solder balls from the IC package come in contact with the crown end of spring pin. The bottom end of spring pin contacts the circuit board pad, completing an electrical path for the signal. The socket mechanism can be summarized as a downward force applied on the IC which compresses solder balls on the spring probe which in turn compresses on the circuit board and thereby making electrical connection.
Grypper Family of Sockets
The Grypper family of test sockets is the next best thing of not having a contact at all. This high-electrical performance socket allows a BGA device to fit into the exact end use location for sample boards, failure analysis, and other applications were space is limited to only the IC package itself. The BGA IC package simply snaps into the socket.
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Grypper test sockets incorporate twin beam contacts insuring minimal resistance.
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G40 test sockets, for 0.4 and 0.5 pitch IC packages, incorporate solder balls onto the contact so re‐flow into your application is the same as re‐flowing an IC to the test or sample board.
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G80 test sockets reduce the force needed for insertions and are ideal for high ball count BGA IC packages.
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"Y" Grypper sockets are designed to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35 pitch and larger and the short electrical length has superior electrical performance.
Grypper Memory Sockets
HSIO has developed sockets for the majority of the memory devices:
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DDR / GDDR - including DDR4
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LPDDR
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eMMC
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ONFi applications.
HSIO stocks many memory socket designs for quick delivery.
Socket Accessories
GigaSnap - SMT Adapters
SMT adapters allow GHz sockets to mount on PCB where no mounting holes exist and SMT pads exist for each contact. Ironwood's standard GHz elastomer or Spring pin sockets or other technology sockets can be mounted on SMT adapters.
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
These SMT adapters require more board space around the device pattern. If the space is limited to chip size, then chip size Giga-snaP female adapter can be solder to the target board. GHz socket mounted on to a male pin adapter can be plugged into the female Giga-snap adapter to complete the connection.
Thru-Hole Male Pin Adapters
Pin adapters allow GHz sockets to mount on PCB where no mounting hole exist and plated thru hole exist for each contact instead of SMT pads. Ironwood's standard GHz elastomer or Spring pin sockets or other technology sockets can be mounted on male pin adapters.
The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006" to 0.018" diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
GHz Sockets mounted to adapter can be either inserted into PCB holes for soldering or plugged on to a Giga-snaP female SMT adapter.
QFN/QFP 35 Family of Sockets (Legacy Product)
High-Performance Test Sockets for Engineering Development, Characterisation, Failure analysis and Manual testing of QFN, QFP DFN and SO IC Packages
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Signal performance: Miniature stamped contacts provide extremely short signal path
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Oxide-cutting wipe action: The QFN35 contact wipes the package pad, cutting through solder oxides
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Near-device decoupling: Small footprints, with large underside frame decoupling pockets designed to standard dimensioned packages, allow for near-device placement of passive components
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Reduced ground inductance: Multiple compliant ground contacts reduce ground inductance and provide a thermal path through the PCB. A solid ground block can be incorporated for further product enhancements
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Replaceable contact sets: Test sockets with replaceable contact sets offer a significant cost savings vs. the purchase of a new test socket
Ironwood Electronics were founded in 1986 and have grown to become one of the foremost manufacturers of high performance test sockets and interconnect solutions in today's market place.
Offering a wide range of elastomer, spring pin and stamped pin sockets to cater for all surface mount component types.
Their extensive range of already tooled designs makes for exceptionally short delivery times and their in house design teams are able to cater for custom designs on very short leadtimes.
Ironwood Electronics has full range manufacturing capabilities in house which gives them an advantage over other companies that outsource a lot of their production manufacturing.