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tapes

Precision Tapes

For almost 30 years Semiconductor Equipment Corporation has set the standard for high quality dicing tape. Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker tape.

Available styles include:

Standard Dicing Tape - most popular economical electronic grade dicing tape

  • Blue Low & Medium Tack Rolls​

  • Clear Low Tack Rolls

  • Thick Clear Low & Medium Tack Rolls

  • Blue Low & Medium Tack Pre-cut Squares

High Purity Pressure Sensitive Tape​ - The perfect tape for clean room applications.

  • Low ionic impurities

  • High Adhesion stability​​

  • Low Tack 75µ Thick

  • Medium Tack 70µ Thick

  • High Tack 145µ Thick​

UV Curable Dicing Tape​ - A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.​Available in a range of thicknesses:

  • 85µ - Most popular UV tape

  • 170µ - For dicing BGAs & ceramic

  • 88µ - For Metalized Wafers

  • 193µ - For Dicing Glass

  • 160µ - For Green Package

  • Plus more, including Anti-ESD films

Backgrinding Tape - Low contamination, consistent thickness accuracy, high acid resistance and effective protection during wet processes. UV and Anti-ESD products available.

Revalpha Heat Release Tape - Excellent for high temperature applications. Available in single and double sided. Polyester film, acrylic adhesive, PET Liner

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Tape Mounter Systems

Semiconductor Equipment Corporation's wafer/film tape applicators provide users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers upto 12" in diameter into die. 

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As well as wafer/film frame systems Semiconductor Equipment Corp also offer a range of Wafer Back Lap Applicators.

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Model 365 UV Exposure Systems

Revolutionary new design cures UV tapes quickly and uniformly, features a long life light source andhandles all size wafers up to 300mm.

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The Model 365 UV exposure system needs no external ventilation and has a small footprint.

 

System features:

  • Cures most UV tape in 5 seconds

  • Programmable N2 purge and cure time

  • Touch screen control

  • Self diagnostic (alarm if LED fails, identifies faulty LED module)

  • 10,000 hour LED life.

  • Generates no ozone

  • Cooling fans temperature controlled

  • Large exposure area cures 300 mm frames for easy cleaning

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Flip Chip Placement & Bonding Systems

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Model 850 Flip Chip Placement System

Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.

An optional heated stage (Model 855) is available. An additional option, SEC´s Model 430 Hot Gas Jet Module can be integrated to operate on the Model 850 as a spot heating source for airflow.

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Features:

  • Manual X, Y sliding table with 13 " x 5 " of travel and ergonomic control arm.

  • Micrometer adjusted X,Y and Theta stage for fine alignment.

  • Pneumatic brakes for XY table movement.

  • 4" square flat vacuum chuck.

  • Cube beam splitter vision system with simultaneous view of die and substrate patterns for alignment.

  • Motorized zoom lens, color camera and TV monitor.

  • Four independent fiber optic ring light illuminators. Two for die and two for substrate illumination.

  • Viewer automatically retracts when Z motion is activated.

  • Automatic Z motion with pneumatic bond control panel adjusted.

  • Pick up tool.

  • Set up kit.

  • Manual.

 

System specifications:

  •  +/- 12 micron placement accuracy.

  • Four 2x2 waffle pack pick-up stage.

  • 4" square vacuum stage standard (optional sizes available).

  • Bond load - 30 to 200 grams standard (10kg optional).

  • Throughput - up to 200 placements per hour.

  • Compressed Air: 60 psi

  • Vacuum: 20" Hg

  • Power: 110V, 3 amp - 60 Hz / 220V, 15 amp - 50 Hz

  • Size: 39 " W x 30 " D x 24 " H​

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Model 865 Flip Chip Bonder

The Model 865 Flip Chip die bonder is ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression and epoxy die bonding. Some of the process capabilities that support these applications are ultrasonic scrub, linear mechanical scrub, compression bonding, flux dipping and hot gas spot heating.  The system is designed for maximum versatility and ease of operation.

 

For Flip Chip applications:

  • Thermocompression bond head with temperatures up to 250 degrees C operation.

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.

  • Dual nozzle hot gas spot heating system for localized heating.

  • Choice of motorized tray or manual tray and doctor blade for flux or adhesive dipping.

 

For bonding edge emitting Laser Diodes:

  • Rapid heat-up stage.

  • Dual tool bond head consisting of one heated die tool and one preform tool.

  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.

  • Direct viewing stereo zoom microscope with 10X eyepieces on pivoting mount with fiber optic illuminators.

  • Single nozzle hot gas heating system for localized heating.

 

Eutectic die bonding:

  • Heated stage with closed loop temperature controls, operation up to 350 degrees C.

  • Dual tool bond head consisting of one heated die tool and one preform tool.

  • Dual nozzle hot gas spot heating system for localized heating.

  • Servo-controlled ultra fine linear scrub bond head with voice coil and preform tool for < 250 degrees C operation; extremely repeatable operation returning to starting point within plus or minus 5 microns.

 

System specifications:

  • 0.5 Micron placement accuracy using alignment plates at 120 degrees C. (Actual die placement accuracy depends on the application).

  • Die sizes up to 2.0" sq.

  • Magnification up to 560X.

  • Viewable area 2.0" square. (with optional X-Y motorized viewer)

  • 2"X2" or 4"X4" waffle pack pick-up stage.

  • Stages 1", 2", 4" square standard. (other sizes and shapes available)

  • Stage temperatures to 450 degrees C (depends on stage selected)

  • Temperature ramp rate for 2" stage (most common) is 20 degrees C per second.

  • Bond load ranges from 10 grams to 10 kilograms. (depends on bond head selected)

  • Bond head temp to 400 degrees C. (depends on bond head selected)

  • Throughput - up to 200 placements per hour.

  • Compressed Air: 60 psi

  • Vacuum: 20" Hg

  • Cover Gas: 40 psi

  • Power: 120V, 10 amp - 50-60 Hz / 220V, 5 amp - 50-60 Hz

  • Size: 44 " W x 38 " D x 72 " H

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Model 835 Pick N Place System

The Model 835 is a general purpose pick and place system for die and surface mount components.  The 835 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages.  A footswitch option controls the pick - up head to lower the pickup tool to working height and return it home.  Open frame design assures full visiblilty and complete access of all system components.  Operator friendly - takes less than two minutes to learn to operate.  Epoxy die bonding capability can be easily added.  The 835 works with any tape - mounted die removal system, including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches. 

 

Options:

  • Die tray pedestal capable of holding up to four 2" X 2" waffle packs.

  • Semiautomatic Z motion.

  • Flat vacuum chuck capable of holding up to four 2" X 2" waffle packs.

  • Stereo zoom microscope and/or projected image cross hair system.

  • High intensity illuminators.

  • Dual position pivoting head for epoxy dispensing.

 

System Specifications:

  • Precision slide table with 18" X 9" travel.

  • Plus or minus 25 micron placement accuracy.

  • Four 2" X 2" waffle pack pickup stage available.

  • Four inch square vacuum stage standard (optional sizes available).

  • Consistent bond load.

  • Throughput - up to 400 placements per hour.

  • Dimensions: 26" W X 18" D X 18" H

  • Weight: 35 lbs.

  • Power: 120 VAC 1 amp or 220 VAC 1 amp

  • Vacuum: 20" Hg

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Hot Gas Rework Systems​

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Model 430 Hot Gas Jet Module

Hot gas jet directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.

  • Hot gas jet which directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.

  • Voltage proportioning temperature controller for closed loop control of the hot gas temperature.

  • Adjustable gas flow with indicator.

  • Round or rectangular nozzles are available in a variety of sizes. One standard .060I.D. nozzle comes with the system.

  • General purpose mounting bracket to facilitate mounting gas jet assembly to your equipment.

  • Footswitch controlled.

  • Three foot long interconnect cable between control module and gas jet assembly.

  • Safety interlocked to prevent heater burnout.

  • Can be used with forming gas or nitrogen.​

Model 450 Hot Gas Rework Station

Bonded die or surface mounted components can be removed with this versatile rework station. Rework can be accomplished without disturbing nearby components or damaging the removed device. Removal heat is applied through an interchangeable nozzle. All process parameters are closely controlled. The versatility of this unit makes it ideal for removing surface mounted components such as leadless chip carriers, eutectic bonded die and epoxy bonded die.

  • Hot gas jet directs heated nitrogen through an interchangeable nozzle to the selected area on the substrate.

  • Idle heat and nitrogen flow through the hot gas jet minimize heater warm up time.

  • A voltage proportioning temperature controller monitors the gas temperature at the nozzle and controls it within a narrow range.

  • Gas temperature is adjustable to 800 º C.

  • Gas flow is adjustable. Flow indicator is mounted on the control panel.

  • Heated work holder eliminates thermal shock and prevents substrate cracking. Temperature controller with digital readout adjustable to 350 º C controls workholder temperature.

  • Interchangeable work chuck mounts on workholder to adapt to various package configurations.

  • Position lock feature holds work holder firmly while hot gas is actuated. Position lock override provided.

  • Push button and parallel foot pedal operation to increase nitrogen flow and temperature from idle to the amount required for die removal. Also actuates work holder position lock.

  • Pressure interlock in nitrogen supply line prevents a low pressure burnout of heater element.

  • One half inch Z motion (vertical travel) manually controlled to permit nozzle to reach into deep packages.

  • Nozzle height can be adjusted 1.5" to give a total range (combined with Z motion) of 2".

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Die Ejector Systems

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Model 4800 Die Eject Grid

A complete system includes a Die Ejector Grid (for .040 x .040 and larger die) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.

In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ring mounting sets.​

Model 4750 Die Ejector System

The Model 4750 Die Ejector ("poker plate") System solves the problem of quick and easy die removal from wafer mounting tape. It can be supplied as a stand alone unit or can be interfaced into your regular or high speed die bonding, pick and place or die inspection equipment. 

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Semiconductor Equipment Corporation is a leading designer and manufacturer of a wide range of manual and semiautomatic assembly, rework, handling, and test equipment used in the development and production of microelectronic devices for the photonics, semiconductor, hybrid and printed circuit industries.

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Semiconductor Equipment Corporation is headquartered in a specially developed modern plant located in Moorpark, California, U.S.A. north of Los Angeles. Its staff includes a team of professionals with acknowledged records of outstanding performance in the semiconductor/electronic components industry. Many of SEC's engineers, including its officers, possess industry experience dating back to the early days of assembly, handling and test.

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